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DNK5306X Datasheet(PDF) 9 Page - STANLEY ELECTRIC CO.,LTD. |
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DNK5306X Datasheet(HTML) 9 Page - STANLEY ELECTRIC CO.,LTD. |
9 / 11 page DNK5306X Page 9 Through-hole IRED/ φ5 High Speed, High Total Output Power Type TTW (Through The Wave) soldering Conditions Solder Bath Temp. Dipping Time 265 ℃ 5 s (MAX.) (MAX.) Position At least 3.0 mm away from the root of lead Iron tip temp. Soldering time and frequency 3 s 1 time 400 ℃ (MAX.) (MAX.) (MAX.) (30 W Max.) Position At least 3.0 mm away from the root of lead 2009.2.2 Pre-heating 100 ℃ (MAX.) Resin surface temperature 1) The dip soldering process shall be twice maximum. 2) The product shall be cooled to normal temperature before the second dipping process. ※The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. Manual Soldering Conditions ※The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. |
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