Integrated Silicon Solution, Inc.

1

Rev. B

01/22/09

Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without

notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-

est version of this device specification before relying on any published information and before placing orders for products.

IS42S32160C

JANUARY 2009

FEATURES:

• Clockfrequency:166,133MHz

• Fullysynchronousoperation

• Internalpipelinedarchitecture

• ProgrammableMode

–CAS#Latency:2or3

–BurstLength:1,2,4,8,orfullpage

–BurstType:interleavedorlinear

+3.3V±0.3V

• LVTTLinterface

• AutoRefreshandSelfRefresh

• IndividualbytecontrolledbyDQM0-3

OPTIONS:

• Dierevision:C

• Configuration(s):16Mx32

• Package(s):90BallBGA(8x13mm)

• Lead-freepackageavailable

• TemperatureRange:CommercialandIndustrial

16Mx32

512Mb SYNCHRONOUS DRAM

DESCRIPTION:

TheISSI'sIS42S32160Cisa512MbSynchronous

DRAMconfiguredasaquad4Mx32DRAM.Itachieves

high-speed data transfer using a pipeline architecture

with a synchronous interface. All inputs and outputs sig-

nals are registered on the rising edge of the clock input,

CLK.The512MbSDRAMisinternallyconfiguredby

stackingtwo256MB,16Mx16devices.Eachofthe4M

x32banksisorganizedas8192rowsby512columns

by32bits.

KEY TIMING PARAMETERS

Parameter

-6

-75

Unit

Clk Cycle Time

CAS Latency = 2

10

10

ns

CASLatency=3

6.0

7.5

ns

ClkFrequency

CASLatency=2

100 100

MHz

CASLatency=3

166 133

MHz

Access Time from Clock

CASLatency=2

6.5

6.5

ns

CASLatency=3

5.4

6

ns

ADDRESS TABLE

Parameter

16Mx32

Configuration

4Mx32x4banks

BankAddressPins

BA0,BA1

AutoprechargePins

A10/AP

RowAddresses

A0–A12

ColumnAddresses

A0–A8

RefreshCount

8192/64ms