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IS61DDB44M18-250M3 Datasheet(PDF) 5 Page - Integrated Silicon Solution, Inc

Part # IS61DDB44M18-250M3
Description  72 Mb (2M x 36 & 4M x 18) DDR-II (Burst of 4) CIO Synchronous SRAMs
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Manufacturer  ISSI [Integrated Silicon Solution, Inc]
Direct Link  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS61DDB44M18-250M3 Datasheet(HTML) 5 Page - Integrated Silicon Solution, Inc

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Integrated Silicon Solution, Inc.
5
Rev. A
05/14/09
72 Mb (2M x 36 & 4M x 18)
DDR-II (Burst of 4) CIO Synchronous SRAMs
The write data is provided in a ‘late write’ mode; that is, the data-in corresponding to the first address of the
burst, is presented 1 cycle later or at the rising edge of the following K clock. The data-in corresponding to the
second write burst address follows next, registered by the rising edge of K. The third data-out is clocked by
the subsequent rising edge of the K clock, and the fourth data-out is clocked by the subsequent rising edge of
the K clock.
The data-in provided for writing is initially kept in write buffers. The information on these buffers is written into
the array on the third write cycle. A read cycle to the last two write address produces data from the write
buffers. The SRAM maintains data coherency.
During a write, the byte writes independently control which byte of any of the four burst addresses is written
(see X18/X36 Write Truth Tables on page
9, 10 and Timing Reference Diagram for Truth Table on page 8).
Whenever a write is disabled (R/W is high at the rising edge of K), data is not written into the memory.
RQ Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to enable the SRAM
to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance
driven by the SRAM. For example, an RQ of 250
Ω results in a driver impedance of 50Ω. The allowable range
of RQ to guarantee impedance matching is between 175
Ω and 350Ω, with the tolerance described in
Programmable Impedance Output Driver DC Electrical Characteristics on page 1
4. The RQ resistor should
be placed less than two inches away from the ZQ ball on the SRAM module. The capacitance of the loaded
ZQ trace must be less than 3 pF.
The ZQ pin can also be directly connected to VDDQ to obtain a minimum impedance setting. ZQ must never
be connected to VSS.
Programmable Impedance and Power-Up Requirements
Periodic readjustment of the output driver impedance is necessary as the impedance is greatly affected by
drifts in supply voltage and temperature. At power-up, the driver impedance is in the middle of allowable
impedances values. The final impedance value is achieved within 1024 clock cycles.
Single Clock Mode
This device can be also operated in single-clock mode. In this case, C and C are both connected high at
power-up and must never change. Under this condition, K and K control the output timings.
Either clock pair must have both polarities switching and must never connect to VREF, as they are not differ-
ential clocks.
Depth Expansion
The following figure depicts an implementation of four
4M x 18 DDR-II SRAMs with common I/Os. In this appli-
cation example, the second pair of C and C clocks is delayed such that the return data meets the data setup
and hold times at the
memory controller.


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