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TPS62650YFFT Datasheet(PDF) 2 Page - Texas Instruments

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Part # TPS62650YFFT
Description  800-mA 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER WITH I2CTM COMPATIBLE INTERFACE IN CHIP SCALE PACKAGING
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS62650YFFT Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
TPS62650
TPS62651
SLVS808 – AUGUST 2009................................................................................................................................................................................................. www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
DEFAULT
I2C ADDRESS BITS(2)
PART
OUTPUT VOLTAGE
PACKAGE
OUTPUT VOLTAGE(2)
PACKAGE(3)
ORDERING
NUMBER(1)
RANGE(2)
MARKING
VSEL0
VSEL1
A2
A1
TPS62650(4)
0.75 V to 1.4375 V
1.05 V
1.2 V
0
1
YFF-9
TPS62650YFF
GJ
TPS62651
0.75 V to 1.4375 V
0.95 V
1.1 V
1
1
YFF-9
TPS62651YFF
GK
(4) (5)
(1)
All devices are specified for operation in the commercial temperature range, –40°C to 85°C.
(2)
For customized output voltage limits (within a 0.75 V to 1.5375 V range), default output voltage and I2C address, contact the factory.
Internal tap points are available to facilitate default output voltage settings in multiples of 50 mV.
(3)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(4)
The following registers bits are set by internal hardware logic and not user programmable through I2C:
a. VSEL0[7] = 1
b. VSEL1[7] = 1
c. CONTROL1[3:2] = 00
(5)
Product preview.
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
at VIN, SW(2)
–0.3 V to
7 V
Input Voltage
at FB (2)
–0.3 V to
3.6 V
at EN, VSEL, SCL, SDA (2)
–0.3 V to
VI + 0.3 V
Power dissipation
Internally limited
Operating junction temperature, TA
(3)
–40°C to
85°C
Maximum operating junction Temperature, TJ
150°C
Storage temperature range, Tstg
–65°C to
150°C
Human body model
2 kV
ESD rating(4)
Charge device model
1 kV
Machine model
200 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (
θ
JA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
(4)
The human body model is a 100-pF capacitor discharged through a 1.5-k
Ω resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
POWER RATING
DERATING FACTOR
PACKAGE
RθJA
(2)
RθJB
(2)
TA ≤ 25°C
ABOVE TA = 25°C
YFF
105°C/W
35°C/W
950 mW
8 mW/°C
(1)
Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max) – TA] / θJA.
(2)
This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
2
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62650 TPS62651


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