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ISL80101IR25Z Datasheet(PDF) 8 Page - Intersil Corporation

Part # ISL80101IR25Z
Description  High Performance 1A LDO
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL80101IR25Z Datasheet(HTML) 8 Page - Intersil Corporation

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8
FN6931.0
December 21, 2009
Output Voltage Selection
An external resistor divider is used to scale the output
voltage relative to the internal reference voltage. This
voltage is then fed back to the error amplifier. The output
voltage can be programmed to any level between 0.8V
and 5V. An external resistor divider, R1 and R2, is used to
set the output voltage as shown in Equation 3. The
recommended value for R2 is 500Ω to 1kΩ. R1 is then
chosen according to Equation 4:
Power Dissipation
The junction temperature must not exceed the range
specified in the Recommended Operating Conditions. The
power dissipation can be calculated by using Equation 5:
The maximum allowed junction temperature, TJ(MAX)
and the maximum expected ambient temperature,
TA(MAX) will determine the maximum allowed junction
temperature rise (ΔTJ) as shown in Equation 6:
To calculate the maximum ambient operating
temperature, use the junction-to-ambient thermal
resistance (θJA) for the DFN package with Equation 5:
Substitute PD for PD(MAX) and the maximum ambient
operating temperature can be found by solving for TA
using Equation 8:
Heatsinking The DFN Package
The DFN package uses the copper area on the PCB as a
heat-sink. The EPAD of this package must be soldered to
the copper plane (GND plane) for heat sinking. Figure 6
shows a curve for the θJA of the DFN package for
different copper area sizes.
V
OUT
0.5V
R
1
R
2
-------
1
+
⎝⎠
⎜⎟
⎛⎞
×
=
(EQ. 3)
R
1
R
2
V
OUT
0.5V
----------------
1
⎝⎠
⎛⎞
×
=
(EQ. 4)
P
D
V
IN
V
OUT
() I
OUT
V
IN
I
GND
×
+
×
=
(EQ. 5)
ΔT
J
T
JMAX
() TAMAX
()
=
(EQ. 6)
P
DMAX
()
T
JMAX
() TA
() θ
JA
=
(EQ. 7)
T
A
T
JMAX
P
DMAX
() θJA
×
=
(EQ. 8)
FIGURE 6. 3mmx3mm-10 PIN DFN ON 4-LAYER PCB
WITH THERMAL VIAS θJA vs EPAD-MOUNT
COPPER LAND AREA ON PCB
46
44
42
40
38
36
34
2468
10
12
14
16
18
20
22
24
EPAD-MOUNT COPPER LAND AREA ON PCB, mm
2
ISL80101


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