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ISL80101IR25Z Datasheet(PDF) 8 Page - Intersil Corporation |
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ISL80101IR25Z Datasheet(HTML) 8 Page - Intersil Corporation |
8 / 15 page 8 FN6931.0 December 21, 2009 Output Voltage Selection An external resistor divider is used to scale the output voltage relative to the internal reference voltage. This voltage is then fed back to the error amplifier. The output voltage can be programmed to any level between 0.8V and 5V. An external resistor divider, R1 and R2, is used to set the output voltage as shown in Equation 3. The recommended value for R2 is 500Ω to 1kΩ. R1 is then chosen according to Equation 4: Power Dissipation The junction temperature must not exceed the range specified in the Recommended Operating Conditions. The power dissipation can be calculated by using Equation 5: The maximum allowed junction temperature, TJ(MAX) and the maximum expected ambient temperature, TA(MAX) will determine the maximum allowed junction temperature rise (ΔTJ) as shown in Equation 6: To calculate the maximum ambient operating temperature, use the junction-to-ambient thermal resistance (θJA) for the DFN package with Equation 5: Substitute PD for PD(MAX) and the maximum ambient operating temperature can be found by solving for TA using Equation 8: Heatsinking The DFN Package The DFN package uses the copper area on the PCB as a heat-sink. The EPAD of this package must be soldered to the copper plane (GND plane) for heat sinking. Figure 6 shows a curve for the θJA of the DFN package for different copper area sizes. V OUT 0.5V R 1 R 2 ------- 1 + ⎝⎠ ⎜⎟ ⎛⎞ × = (EQ. 3) R 1 R 2 V OUT 0.5V ---------------- 1 – ⎝⎠ ⎛⎞ × = (EQ. 4) P D V IN V OUT – () I OUT V IN I GND × + × = (EQ. 5) ΔT J T JMAX () TAMAX () – = (EQ. 6) P DMAX () T JMAX () TA – () θ JA ⁄ = (EQ. 7) T A T JMAX P DMAX () θJA × – = (EQ. 8) FIGURE 6. 3mmx3mm-10 PIN DFN ON 4-LAYER PCB WITH THERMAL VIAS θJA vs EPAD-MOUNT COPPER LAND AREA ON PCB 46 44 42 40 38 36 34 2468 10 12 14 16 18 20 22 24 EPAD-MOUNT COPPER LAND AREA ON PCB, mm 2 ISL80101 |
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