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APL531230S5I-TRG Datasheet(PDF) 9 Page - Anpec Electronics Coropration |
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APL531230S5I-TRG Datasheet(HTML) 9 Page - Anpec Electronics Coropration |
9 / 15 page Copyright © ANPEC Electronics Corp. Rev. A.4 - Jun., 2009 APL5312 www.anpec.com.tw 9 Application Information (Cont.) Recommended Minimum Footprint Operating Region and Power Dissipation (Cont.) is the thermal resistance between Junction and ambient air. For continual operation, do not exceed the absolute maximum junction Temperature rating of T J = 125°C. For example: The SOT-23-5 package has maximum power dissipa- tion 300mW at T A= 55°C, relatively 225mW at SC-70-5 package (see Maximum Power Dissipation vs. Ambient Temperature). V IN = 5V, IOUT = 250mA, VOUT = 3.3V, P D = (5-3.3)V x 150mA = 255mW According the power dissipation issue, we should adapt the SOT-23-5 package. It could reduce the thermal resistance to maintain the IC longer life. The GND pin provides an electrical connection to the ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. 0.02 0.038 0.076 Unit : Inch 0.016 0.026 0.052 Unit : Inch SOT-23-5 SC-70-5 |
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