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APL5325BI-TRG Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APL5325BI-TRG Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
2 / 15 page Copyright © ANPEC Electronics Corp. Rev. A.1 - Nov., 2008 APL5325 www.anpec.com.tw 2 Symbol Parameter Rating Unit VIN VIN Supply Voltage (VIN to GND) -0.3 ~ 6.5 V VSHDN SHDN Input Voltage (SHDN to GND) -0.3 ~ 6.5 V PD Power Dissipation Internally Limited W TJ Junction Temperature -40 ~ 150 oC TSTG Storage Temperature -65 ~ 150 oC TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC Absolute Maximum Ratings (Note 1) Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Thermal Resistance-Junction to Ambient (Note 2) SOT-23-5 240 oC/W θ JC Thermal Resistance-Junction to Case SOT-23-5 130 oC/W Note 2 : θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions Symbol Parameter Range Unit VIN VIN Supply Voltage 3 ~ 6 V VOUT Output Voltage 0.8 ~ 5.5 V IOUT VOUT Output Current 0 ~ 300 mA CIN Input Capacitor 0.22 ~ 100 µF COUT Output Capacitor 1.5 ~ 100 µF TJ Junction Temperature -40 ~ 125 oC Ordering and Marking Information APL5325 Package Code B: SOT-23-5 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device Assembly Material Handling Code Temperature Range Package Code APL5325 B : 25RX XXXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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