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LA79B-1-SEG.X.SEG.SEG-PF Datasheet(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LA79B-1-SEG.X.SEG.SEG-PF Datasheet(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 7 page Thermal Shock Test Solderability Test Solder Resistance Test High Temperature High Humidity Test Low Temperature Storage Test High Temperature Storage Test MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=85 ℃ 2.RH=85% 3.t=240hrs ±2hrs MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reliability Test: Operating Life Test Test Item Page 6/6 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Description 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA79B-1/SEG.X.SEG.SEG-PF |
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