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SN74AUP3G07YFPR Datasheet(PDF) 2 Page - Texas Instruments |
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SN74AUP3G07YFPR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 13 page 1A 1Y 1 7 2A 2Y 3 5 3A 3Y 6 2 SN74AUP3G07 SCES780A – DECEMBER 2009 – REVISED DECEMBER 2009 www.ti.com The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) ORDERABLE TOP-SIDE TA PACKAGE(2) PART NUMBER MARKING(3) NanoStar™ – WCSP (DSBGA) Reel of 3000 SN74AUP3G07YFPR _ _ H V _ 0.23-mm Large Bump – YFP (Pb-free) uQFN – DQE Reel of 5000 SN74AUP3G07DQER TW –40°C to 85°C QFN – RSE Reel of 5000 SN74AUP3G07RSER PREVIEW SSOP – DCU Reel of 3000 SN74AUP3G07DCUR H07_ (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT OUTPUT A Y L L H Z LOGIC DIAGRAM (POSITIVE LOGIC) Pin numbers shown are for the DCU and DQE packages. 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUP3G07 |
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