1A

1Y

1

7

2A

2Y

3

5

3A

3Y

6

2

SN74AUP3G07

SCES780A – DECEMBER 2009 – REVISED DECEMBER 2009

www.ti.com

The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement

active-low wired-OR or active-high wired-AND functions.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE

TOP-SIDE

PART NUMBER

NanoStar™ – WCSP (DSBGA)

Reel of 3000

SN74AUP3G07YFPR

_ _ H V _

0.23-mm Large Bump – YFP (Pb-free)

uQFN – DQE

Reel of 5000

SN74AUP3G07DQER

TW

–40°C to 85°C

QFN – RSE

Reel of 5000

SN74AUP3G07RSER

PREVIEW

SSOP – DCU

Reel of 3000

SN74AUP3G07DCUR

H07_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

FUNCTION TABLE

(EACH BUFFER/DRIVER)

INPUT

OUTPUT

A

Y

L

L

H

Z

LOGIC DIAGRAM (POSITIVE LOGIC)

Pin numbers shown are for the DCU and DQE packages.

2

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Product Folder Link(s): SN74AUP3G07