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B57251V5472J060 Datasheet(PDF) 11 Page - EPCOS |
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B57251V5472J060 Datasheet(HTML) 11 Page - EPCOS |
11 / 19 page Reflow soldering Recommended temperature characteristic for reflow soldering following J-STD-020C Profile feature Sn-Pb eutectic assembly Pb-free assembly Average ramp-up rate (TSmax to Tp) 3 °C/ second max. 3 °C/ second max. Preheat - Temperature min (TSmin) 100 °C 150 °C - Temperature max (TSmax) 150 °C 200 °C - Time (tSmin to tSmax) 60 ... 120 seconds 60 ... 180 seconds Time maintained above: - Temperature min (TL) 183 °C 217 °C - Time (tL) 60 ... 150 seconds 60 ... 150 seconds Peak/ classification temperature (Tp) 220 °C ... 240 °C 240 °C ... 260 °C Time within 5 °C of actual peak temperature (tp) 10 ... 30 seconds 20 ... 40 seconds Ramp-down rate 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Temperature measurement and compensation B572**V5 SMD NTC thermistors for automotive, case size 0402 (1005) Automotive Page 11 of 19 Please read Cautions and warnings and Important notes at the end of this document. |
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