Reflow soldering

Recommended temperature characteristic for reflow soldering following J-STD-020C

Profile feature

Sn-Pb eutectic assembly

Pb-free assembly

Average ramp-up rate

3

°C/ second max.

3

°C/ second max.

Preheat

100

°C

150

°C

150

°C

200

°C

60 ... 120 seconds

60 ... 180 seconds

Time maintained above:

183

°C

217

°C

60 ... 150 seconds

60 ... 150 seconds

Peak/ classification

220

°C ... 240 °C

240

°C ... 260 °C

Time within 5

°C of actual

10 ... 30 seconds

20 ... 40 seconds

Ramp-down rate

6

°C/ second max.

6

°C/ second max.

Time 25

°C to peak

temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Temperature measurement and compensation

B574**V5

SMD NTC thermistors for automotive, case size 0805 (2012)

Automotive

Page 11 of 19

Please read Cautions and warnings and

Important notes at the end of this document.