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W2630 Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard)

Part # W2630
Description  DDR2 BGA Probes for Logic Analyzers
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

W2630 Datasheet(HTML) 2 Page - Agilent(Hewlett-Packard)

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Features
The Agilent W2630 Series DDR2
BGA probes for logic analyzers and
oscilloscopes enable viewing of data
traffic on industry standard DDR2
DRAMs with the Agilent 16900 Series
logic analysis system and Infiniium
80000 Series oscilloscopes.
Features
Benefits
Connects directly to the DDR2 BGA
balls
Eliminates reflections from mid-bus probing
methods. Also eliminates board space and trace
routing required for connector probing methods.
Supports:
• x8 (84 ball) all signals
• x16 (92 ball) all signals and
x16 (84 ball) without mechanical
support balls
• x4 (60 ball) dual die packages
with traces to CS0, CKE0, and
OTD0 only
• Quad die packages with W2632A
and traces to CS0, CKE0 and
ODT0 only
Get complete signal access to the DDR2 signals
critical to your debug and validation effort
Buried resistors provide signal
isolation and minimize capacitive
loading.
Probe loading: 2 pF
Minimum signal amplitude:
• 250 mV p-p for single-ended
signals
• V
max – Vmin 100 mV for differential
signals
Acquire high-speed signals without impacting
the performance of your design. The DDR2 BGA
probe provides a non-intrusive electrical and
mechanical connection between the memory
device and an Agilent 16900 Series logic
analyzer.
• Operating transfer rate of
800 Mb/s
• 2 GHz bandwidth
Operate at full speed whether you’re making
measurements with a logic analyzer or
oscilloscope.
Works with existing designs
Eliminates need for re-design or up front
planning.
Supports either leaded or lead-free
solder
Easily works with all solder finishes. Designed
to tolerate lead-free soldering temperature
profiles.
Contract manufactures available for
those without the in-house expertise
or facilities for soldering BGAs
Eliminates the need to develop BGA soldering
expertise.
Flexible “wings” with ZIF connectors Ensures reliable connection to the ZIF probes.
Enables placement of the probe cables around
adjacent components. Minimizes the torque to
the balls of the BGA.
Attach to E5384A, E5826A, or
E5827A single-ended ZIF probes for
connection to the logic analyzer
Optimizes the use of logic analyzer channels by
allowing assignment of channels to 8 or 16 bits
on each DRAM.
Probe points available for soldering
ZIF tip accessories to the scope
probe adapter board that connects
to the BGA probe
Enables oscilloscope probing of the DRAM
signals with an Agilent Infiniium 80000
Series oscilloscope, giving you a DDR2 test
solution covering the clock characterization,
electrical and timing parameters of the JEDEC
specification.


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