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ST7687A Datasheet(PDF) 10 Page - Sitronix Technology Co., Ltd. |
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ST7687A Datasheet(HTML) 10 Page - Sitronix Technology Co., Ltd. |
10 / 191 page ST7687A Ver. 1.0 10/191 2009/12 3 PAD ARRANGEMENT (COG) Y X (0,0) 1 VSS 2 VPP 3 VPP 4 VPP 5 VPP 8 VSS 149 COM27 212 DUMMY 12 VDD 13 RW_WR 14 D0 15 D1 32 E_RD 33 RW_WR 34 A0 35 /RST 36 IF1 37 IF2 38 IF3 41 /CS 42 /EXT 43 TE 44 TCAP 45 VDD 46 VDD 47 VDD 48 VDD 49 VD1in 50 VD1in 53 VD1out 54 VD1out 7 CLS 11 A0 79 VDD4 73 VSS4 72 VSS4 71 VSS2 61 VSS 60 VSS 59 VSS 58 VSS 57 VSS 56 VSS1 134 Vgin 127 Vgin 126 Vgs 125 Vgout 124 Vgout 122 XV0in 121 XV0in 123 XV0in 120 XV0in 119 XV0s 113 V0in 112 V0in 111 V0in 86 VDD2 85 VDD5 80 VDD5 78 VDD4 77 VDD3 75 VREF 76 VDD3 74 VSS4 135 VSS 6 CL 55 VSS1 62 VSS2 213 SEG0 660 COM26 597 DUMMY 596 SEG383 9 VDD 10 INTVD1 16 D2 17 D3 18 D4 19 D5 20 D6 21 D7 22 D8 23 D9 24 D10 25 D11 26 D12 27 D13 28 D14 29 D15 30 VSS 31 VDD 39 VSS 40 VDD 51 VD1in 52 VD1in 118 XV0out 117 XV0out 116 V0out 115 V0out 114 V0s 110 V0in 93 VDD2 94 VSS2 103 VSS2 104 Vm 109 Vm …… 199 COM127 200 DUMMY 609 DUMMY 610 COM126 …… Chip Size : 11586 um x 686 um Bump Pitch : PAD 136~148, 149~212, 213~596, 597~660 661~673 pitch=22um (min, com/seg) PAD 212~213, 596~597 pitch=110.88um ( com/seg) PAD 1~7, 10~13, 32~38, 41~57, 59~135 pitch=80um (I/O) PAD 14~29, pitch=120um(I/O) PAD 8~9, 30~31, 39~40, pitch=49um(I/O) PAD 7~8, 9~10, 31~32, 38~39, 40~41, pitch=64.5um(I/O) PAD 57~58, 58~59=75.5um(I/O) PAD 13~14, pitch=100um(I/O) PAD 29~30, pitch=84.5um(I/O) Bump Size : PAD 136~673 Bump width=10.5um (min, com/seg) Bump space=11.5um (min, com/seg) Bump length=166.7um(min, com/seg) Bump area=1750.35um^2(com/seg) PAD 14~29 Bump width=105um(I/O) Bump space=15um(I/O) Bump length=59um(I/O) Bump area=6195um^2 PAD 58 Bump width=56um(I/O) Bump space=15um(I/O) Bump length=59um(I/O) Bump area=3304um^2 PAD 8~9, 30~31, 39~40 Bump width=34um(I/O) Bump space=15um(I/O) Bump length=59um(I/O) Bump area=2006um^2 PAD 1~7, 10~13, 32~38, 41~57, 59~135 Bump width=65um(I/O) Bump space=15um(I/O) Bump length=59um(I/O) Bump area=3185um^2 ST7687A-G4 (Bump Height: 15 um, Hardness: 55HV) ST7687A-G4-1 (Bump Height: 12 um, Hardness: 90HV) Chip Thickness: 300 um Alignment mark The center of alignment mark: see bellow Table |
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