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HP1206R56M2 Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp |
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HP1206R56M2 Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 6 page REF : 20090825-B PAGE: 1 Ⅰ﹒MECHANICAL DIMENSIONS: SPECIFICATION FOR APPROVAL AR-001A POWER INDUCTOR NAME PROD. SHIELDED SMD ABC'S ITEM No. ABC'S DWG No. ( PCB Pattern ) m/m m/m E : 2.00 ± 0.5 F : 5.00 typ. m/m m/m m/m m/m A : 13.5 ± 0.4 D : 6.50 max. C : 4.00 ± 0.3 B : 12.5 ± 0.3 ( White ) Inductance code Marking A E G H m/m G : 8.00 typ. m/m H : 14.0 typ. Ⅱ﹒SCHEMATIC DIAGRAM: a ﹒Core:Iron powder b ﹒Wire:Enamelled copper wire Ⅲ﹒MATERIALS LIST: 2 1 Time ( seconds ) 100 0 50 150 200 250 50 100 250 Max time above 200℃ :70sec max. Max time above 230℃ :50sec max. Peak Temp:260℃ max. +4.0 / sec max. ℃ T empera ture Rising Ar ea 5 0sec max. 150 ~ 200 / 60~120sec ℃ Pre he at Area 2 60℃ -( 1.0 ~ 5.0) /sec max. ℃ Force d Cooling Ar ea 200 / se c ma x. 150 +2.0 ~ 4.0℃ 7 0sec max. 230℃ Reflow Area Pea k Te mperature: c ﹒Resistance to solder heat:260℃. 10 secs. a ﹒Storage temp.:-55℃~ +125℃ b ﹒Operating temp .:-55℃~ +125℃ ( Temp. rise included ) Ⅳ﹒GENERAL SPECIFICATION: d ﹒Remark:Products comply with RoHS' requirements c ﹒Cilp:Cu / Ni /Sn HP1206□□□□2□-□□□ a b c |
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