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B57561G0202H002 Datasheet(PDF) 8 Page - EPCOS |
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B57561G0202H002 Datasheet(HTML) 8 Page - EPCOS |
8 / 15 page Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Iron soldering Bath temperature max. 260 °C max. 360 °C Soldering time max. 4 s max. 2 s Distance from thermistor min. 6 mm min. 6 mm Under more severe soldering conditions the resistance may change. 1.2 Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content should be used. In addition, soldering methods should be employed which permit short soldering times. 2 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 3 Robustness of terminations (leaded types) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feed- throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Tensile strength: Test Ua1: Leads ∅ ≤0.25 mm = 1.0 N 0.25 < ∅ ≤0.35 mm = 2.5 N 0.35 < ∅ ≤0.50 mm = 5.0 N 0.50 < ∅ ≤0.80 mm = 10.0 N 0.80 < ∅ ≤1.25 mm = 20.0 N Temperature measurement B57561G, B57561G1 Glass-encapsulated sensors with insulation G561/G1561 Page 8 of 15 Please read Cautions and warnings and Important notes at the end of this document. |
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