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TLC59281DBQ Datasheet(PDF) 6 Page - Texas Instruments |
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TLC59281DBQ Datasheet(HTML) 6 Page - Texas Instruments |
6 / 19 page LAT OUT0 OUT1 OUT2 OUT3 OUT4 BLANK OUT15 OUT14 OUT13 OUT12 OUT11 1 2 3 4 5 6 18 17 16 15 14 13 ThermalPad (BottomSide) TLC59281 GND SIN SCLK LAT OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 VCC IREF SOUT BLANK OUT15 OUT14 OUT13 OUT12 OUT11 OUT10 OUT9 OUT8 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 TLC59281 TLC59281 SBVS139 – JANUARY 2010 www.ti.com DEVICE INFORMATION SO-24 QFN-24 DBQ PACKAGE RGE PACKAGE (TOP VIEW) (TOP VIEW) NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB pattern. 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59281 |
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