Electronic Components Datasheet Search |
|
AS1369-BWLT-50 Datasheet(PDF) 3 Page - ams AG |
|
AS1369-BWLT-50 Datasheet(HTML) 3 Page - ams AG |
3 / 16 page www.austriamicrosystems.com Revision 1.03 3 - 16 AS1369 Data Sheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character- istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. P(MAX) = (TJ(MAX) - (TAMB))/ ΘJA (EQ 1) Where: The value of ΘJA for the WLP package is 345°C/W. Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the regulator will go into thermal shutdown. The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to direct light could cause device malfunction. Table 2. Absolute Maximum Ratings Parameter Min Max Units Comments Input Supply Voltage -0.3 +7 V Shutdown Input Voltage -0.3 +7 V Output Voltage -0.3 +7 V IOUT Short-circuit protected. Input/Output Voltage 1 1. The output PNP structure contains a diode between pins VIN and VOUT that is normally reverse-biased. revers- ing the polarity of pins VIN and VOUT will activate this diode. -0.3 +7 V Power Dissipation 2 2. The maximum allowable power dissipation is a function of the maximum junction temperature (TJ(MAX), the junction-to-ambient thermal resistance ( ΘJA), and the ambient temperature (TAMB). The maximum allowable power dissipation at any ambient temperature is calculated as: 360 mW Internally limited. Mounted on PCB. Operating Junction Temperature -40 +125 ºC Storage Temperature Range -65 +150 ºC ESD 2kV HBM MIL-Std. 883E 3015.7 methods 500 V CDM JESD22-C101C methods Latch-Up -100 +100 mA JEDEC 78 Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). |
Similar Part No. - AS1369-BWLT-50 |
|
Similar Description - AS1369-BWLT-50 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |