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AS1528-BTDT Datasheet(PDF) 4 Page - ams AG |
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AS1528-BTDT Datasheet(HTML) 4 Page - ams AG |
4 / 21 page www.austriamicrosystems.com Revision 1.02 4 - 21 AS1528/AS1529 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character- istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter Min Max Units Comments VDD to GND -0.3 +6 V CNVST, SCLK, DOUT, REF, AIN1/ AIN+, AIN2/AIN- to GND -0.3 VDD + 0.3 V Current into Any Pin 50 mA Continuous Power Dissipation 1491 mW TAMB = +70ºC; derate 19.5mW/ºC above +70ºC Operating Temperature Range -40 +85 ºC Storage Temperature Range -60 +150 ºC Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020D “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). |
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