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CND2047 Datasheet(PDF) 10 Page - United Monolithic Semiconductors |
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CND2047 Datasheet(HTML) 10 Page - United Monolithic Semiconductors |
10 / 10 page CND2047 10GHz Frequency Divider by 4 Ref. : DSCND20470077 -17-Mar-00 10/10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Chip Mechanical Data Vdd Vdd Vdd1 CKB CK GND GND GND QB Q dimensions in µm : 1050 (+10 /-100) * 900 (+10 /-100) Thickness= 300µm ± 20µm Pads area: 100*100µm Recommended die attach Epoxy die attach is recommended. Minimum quantity of electrically conductive epoxy must be used, with a narrow fillet around the die after contact Recommended bonding Bonding pads of the product are covered with aluminium metallic layer. Wedge or ball bonding can be used. Aluminium wire has be used if the assembly process is up to 250°C. Otherwise the use of gold wire is possible. The ground bounding length should be as short as possible to optimize the use of the product. The bonder should be properly grounded. Note 1: Vdd1 is used to connect the output buffers (on Q/QB) and can be applied separately from Vdd. Ordering Information Chip form :CND2047-99F/00 FTP8 Package :CND2047-SNF/23 SOIC8 Package :CND2047-DAF/20 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. |
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