CND2047

10GHz Frequency Divider by 4

Ref. : DSCND20470077 -17-Mar-00

10/10

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Chip Mechanical Data

Vdd

Vdd

Vdd1

CKB

CK

GND

GND

GND

QB

Q

dimensions in µm :

1050 (+10 /-100) * 900 (+10 /-100)

Thickness= 300µm

± 20µm

Pads area: 100*100µm

Recommended die attach

Epoxy die attach is recommended.

Minimum quantity of electrically conductive

epoxy must be used, with a narrow fillet

around the die after contact

Recommended bonding

Bonding pads of the product are covered

with aluminium metallic layer.

Wedge or ball bonding can be used.

Aluminium wire has be used if the

assembly process is up to 250°C.

Otherwise the use of gold wire is possible.

The ground bounding length should be as

short as possible to optimize the use of the

product.

The bonder should be properly grounded.

Note 1: Vdd1 is used to connect the output

buffers (on Q/QB) and can be applied

separately from Vdd.

Ordering Information

Chip form

:CND2047-99F/00

FTP8 Package

:CND2047-SNF/23

SOIC8 Package

:CND2047-DAF/20

Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors

S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of

patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for

use as critical components in life support devices or systems without express written approval from United

Monolithic Semiconductors S.A.S.