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NCP1237AD65R2G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCP1237AD65R2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 34 page NCP1237 http://onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit Supply Pin (pin 6) (Note 2) Voltage range Current range VCCMAX ICCMAX –0.3 to 28 $30 V mA High Voltage Pin (pin 8) (Note 2) Voltage range Current range VHVMAX IHVMAX –0.3 to 500 $20 V mA Driver Pin (pin 5) (Note 2) Voltage range Current range VDRVMAX IDRVMAX –0.3 to 20 $1000 V mA All other pins (Note 2) Voltage range Current range VMAX IMAX –0.3 to 10 $10 V mA Thermal Resistance SOIC−7 Junction−to−Air, low conductivity PCB (Note 3) Junction−to−Air, medium conductivity PCB (Note 4) Junction−to−Air, high conductivity PCB (Note 5) RqJA 162 147 125 °C/W Temperature Range Operating Junction Temperature Storage Temperature Range TJMAX TSTRGMAX −40 to +150 −60 to +150 °C ESD Capability (Note 1) Human Body Model (HBM) Model (All pins except HV) Machine Model (MM) 2000 190 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per JEDEC standard JESD22, Method A114E Machine Model Method 200 V per JEDEC standard JESD22, Method A115A 2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78 3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2of 1 oz copper traces and heat spreading area. As specified for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow. 5. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2of 1 oz copper traces and heat spreading area. As specified for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow. |
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