DATA SHEET • SKY73085-11 DOWNCONVERSION MIXER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

200990B • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • April 1, 2009

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Evaluation Board Description

The SKY73085-11 Evaluation Board is used to test the

performance of the SKY73085-11 downconversion mixer. An

assembly drawing for the Evaluation Board is shown in Figure 29

and the layer detail is provided in Figure 30. A schematic diagram

of the SKY73085-11 Evaluation Board is shown in Figure 31.

Circuit Design Configurations

The following design considerations are general in nature and

must be followed regardless of final use or configuration:

1. Paths to ground should be made as short as possible.

2. The ground pad of the SKY73085-11 has special electrical

and thermal grounding requirements. This pad is the main

thermal conduit for heat dissipation. Since the circuit board

acts as the heat sink, it must shunt as much heat as possible

from the device. Therefore, design the connection to the

ground pad to dissipate the maximum wattage produced by

the circuit board.

3. Skyworks recommends including external bypass capacitors

on the VCC voltage inputs of the device.

4. Components L5, L6, L14, and L15 (see Figure 31) are high-Q

low loss inductors. These inductors must be able to pass

currents in excess of 200 mA DC.

5. Components R1 and R2 (see Figure 31) set the bias current

for the IF amplifiers. Skyworks recommends that these

resistors have a tolerance of

±1% to optimize performance

consistency of the SKY73085-11. These resistors are not

required for the Evaluation Board to operate as specified in

Tables 3 and 4.

Package Dimensions

The PCB layout footprint for the SKY73085-11 is provided in

Figure 32. Figure 33 shows the package dimensions for the

36-pin MCM and Figure 34 provides the tape and reel

dimensions.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it is

baked and vacuum packed before shipping. Instructions on the

shipping container label regarding exposure to moisture after the

container seal is broken must be followed. Otherwise, problems

related to moisture absorption may occur when the part is

subjected to high temperature during solder assembly.

THE SKY73085-11 is rated to Moisture Sensitivity Level 3 (MSL3)

at 260

°C. It can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

PCB Design & SMT Assembly/Rework Guidelines for MCM-L

Packages, document number 101752.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format. For packaging details, refer to the Skyworks

Application Note, Tape and Reel, document number 101568.

Electrostatic Discharge (ESD) Sensitivity

The SKY73085-11 is a static-sensitive electronic device. Do not

operate or store near strong electrostatic fields. Take proper ESD

precautions.