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MAX19790ETX+ Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX19790ETX+ Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 11 page 250MHz to 4000MHz Dual, Analog Voltage Variable Attenuator 2 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VCC to GND..........................................................-0.3V to +5.5V CTRL to GND (with VCC = +5.0V applied) ............ 0V to +4.75V All Other Pins to GND .................................-0.3V to VCC + 0.3V RF Input......................................................................... +20dBm Current into CTRL Pin (VCC grounded) .............................40mA Maximum Junction Temperature.....................................+150°C Operating Temperature Range.......................... -40°C to +85°C Storage Temperature Range........................….-65°C to +150°C Continuous Power Dissipation (TC = +85°C) (Note 1) .......2.1W θJC (Notes 2, 4)............................................................ +10°C/W θJA (Notes 3, 4)............................................................ +35°C/W Lead Temperature (soldering, 10s) ................................+300°C Soldering Temperature (reflow) ......................................+260°C DC ELECTRICAL CHARACTERISTICS (VCC = +4.75V to +5.25V, VCTRL = +1.0V to +4.0V, no RF signals applied, all input and output ports terminated with 50I, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5.0V, VCTRL = +1.0V, TC = +25°C, unless otherwise noted.) RECOMMENDED AC OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS Note 1: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Note 2: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. CAUTION! ESD SENSITIVE DEVICE PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SUPPLY Supply Voltage VCC 4.75 5.0 5.25 V Supply Current ICC 7.3 9.5 mA CONTROL INPUT Control Voltage Range VCTRL (Note 5) 1.0 4.0 V Control Input Resistance RCTRL 50 kI PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency Range fRF (Note 6) 250 4000 MHz |
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