APTGL90H120T3G datasheet(3/5 Pages) MICROSEMI

Part #	APTGL90H120T3G

Description	Full bridge Trench Field Stop IGBT4 Power module

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Manufacturer	MICROSEMI [Microsemi Corporation]

Direct Link	http://www.microsemi.com

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APTGL90H120T3G

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Thermal and package characteristics

Symbol

Characteristic

Min

Typ

Max

Unit

IGBT

0.39

RthJC

Junction to Case Thermal Resistance

Diode

0.62

°C/W

VISOL

RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz

2500

V

TJ

Operating junction temperature range

-40

175

TSTG

Storage Temperature Range

-40

125

TC

Operating Case Temperature

-40

100

°C

Torque Mounting torque

To heatsink

M4

2.5

4.7

N.m

Wt

Package Weight

110

g

Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).

Symbol

Characteristic

Min

Typ

Max

Unit

R25

Resistance @ 25°C

50

k

Ω

∆R25/R25

5

%

B25/85

T25 = 298.15 K

3952

K

∆B/B

TC=100°C

4

%

⎥

⎦

⎤

⎢

⎣

⎡

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

−

=

T

B

R

T

1

exp

25

85

/

25

SP3 Package outline (dimensions in mm)

12

1

See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com

T: Thermistor temperature

RT: Thermistor value at T

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APTGL90H120T3G Datasheet(PDF) 3 Page - Microsemi Corporation

APTGL90H120T3G Datasheet(HTML) 3 Page - Microsemi Corporation

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