WM2623

Production Data

WOLFSON MICROELECTRONICS LTD

PD Rev 1.0 October 2000

10

PACKAGE DIMENSIONS

DM009.B

D: 8 PIN SOIC 3.9mm Wide Body

Symbols

Dimensions

(mm)

Dimensions

(Inches)

MINMAX

MINMAX

A

1.35

1.75

0.0532

0.0688

0.10

0.25

0.0040

0.0098

B

0.33

0.51

0.0130

0.0200

C

0.19

0.25

0.0075

0.0098

D

4.80

5.00

0.1890

0.1968

e

1.27 BSC

0.050 BSC

E

3.80

4.00

0.1497

0.1574

h

0.25

0.50

0.0099

0.0196

H

5.80

6.20

0.2284

0.2440

L

0.40

1.27

0.0160

0.0500

α

0

o

8

o

0

o

8

o

REF:

JEDEC.95, MS-012

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).

D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

C

α

L

A

A1

SEATING PLANE

-C-

0.10 (0.004)

4

1

D

5

8

E

H

B

e