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BH7881EFV Datasheet(PDF) 6 Page - Rohm |
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BH7881EFV Datasheet(HTML) 6 Page - Rohm |
6 / 9 page 6/8 8. Pop noise at start/end when switching ACTV/SPND Pop noise can be suppressed by mode transition due to software as in “Pop noise” above, or by hardware as shown below. This is realized (in SP mode) by forcibly setting HP mode temporarily, using the CR differential circuit. 9. Power package 1) In order to expand the power dissipation of the package, make the GND pattern, directly below the IC, as wide as possible and solder the GND pattern to the back of the IC. 2) Power dissipation of the package varies greatly depending on factors such as the number of layers, area, film thickness, and material quality of the board used. 10. Other Beween voltages of VCC=1.4 ~ 1.6 V, momentary oscillation sometimes is observed at the SPOUT pin. Nevertheless, this occurrence is not reproduced on a momentary rise or fall of VCC. When slowly raising VCC pay attention to transient voltage. In order to avoid such occurrences, a sample circuit is illustrated below: ●Application circuit (1 of 2) Fig.4 Minimum external components example |
Similar Part No. - BH7881EFV_05 |
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Similar Description - BH7881EFV_05 |
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