X25F087

6

Figure 5. Sector Program Operation Sequence

Figure 6. Program Status Operation Sequence

32 33 34 35 36 37 38 39

SCK

SI

CS

0

1

2

3

4

5

6

7

8

9

10

SCK

SI

PROGRAM

INSTRUCTION

BYTE ADDRESS

(2 BYTE)

DATA BYTE 1

7

6

5

4

3

2

1

0

CS

40 41 42 43 44 45 46 47

DATA BYTE 2

7

6

5

4

3

2

1

0

DATA BYTE 3

7

6

5

4

3

2

1

0

15 14 13

3

2

1

0

20 21 22 23 24 25 26 27 28 29 30 31

6

5

4

3

2

1

0

7007 FRM 07.1

DATA BYTE 16

0

1

2

3

4

5

6

7

8

9

CS

SCK

SI

SO

HIGH IMPEDANCE

PROGRAM STATUS

INSTRUCTION

10 11 12 13 14 15

7007 FRM 08

BLOCK LOCK

PROTECTION BYTE

B

L

1

B

L

0

B

L

2

0

0

0

0

0

ABSOLUTE MAXIMUM RATINGS*

Temperature under Bias ................... –65

°C to +135°C

Storage Temperature........................ –65

°C to +150°C

Voltage on any Pin with

D.C. Output Current ..............................................5mA

Lead Temperature

(Soldering, 10 seconds) .............................. 300

°C

*COMMENT

Stresses above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

This is a stress rating only and the functional operation of

the device at these or any other conditions above those

indicated in the operational sections of this specification

is not implied. Exposure to absolute maximum rating con-

ditions for extended periods may affect device reliability.