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FTR-B3SA1.5Z-RF Datasheet(PDF) 6 Page - Fujitsu Component Limited.

Part # FTR-B3SA1.5Z-RF
Description  ULTRA MINIATURE Flat High-Frequency Relay Surface mount, 1GHz-Band, 2 Form C
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Manufacturer  FUJITSU [Fujitsu Component Limited.]
Direct Link  http://edevice.fujitsu.com/fmd/en/index.html
Logo FUJITSU - Fujitsu Component Limited.

FTR-B3SA1.5Z-RF Datasheet(HTML) 6 Page - Fujitsu Component Limited.

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6
Ftr-B3-rF series
roHs Compliance and Lead Free relay Information
Reflow Solder condition
3. Moisture sensitivity
l
Moisture Sensitivity Level 3 for FTR-B3 relays.
4. tin Whisker
l
SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable whisker length was found
by our in-house test.
We highly recommend that you confirm your actual solder conditions
Flow Solder condition:
Pre-heating:
maximum 120˚C
Soldering:
dip within 5 sec. at
260˚C solder bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
1. General Information
l
Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
l
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays.
l
All signal and power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
l
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
l
“LF” is marked on each outer and inner carton. (No marking on individual relays).
l
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
l
We will ship leaded relays as long as the leaded relay inventory exists.
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Profile
l
Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0Cu-Ni (only FTR-B3 and FTR-B4 from
February 2005.
max. 120 sec.
90~120 sec.
20~30 sec.
(duration)
Cooling
Pre-heating
Soldering
Peak Temp.: max. 250°C
250
220
130
170


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