FTR-B4 Series

9

RoHS Compliance and Lead Free Relay Information

Reflow Solder condition

3. Moisture Sensitivity

l

MoistureSensitivityLevelisnotapplicabletoelectromechanicalrelays.

4. Tin Whisker

l

SnAgCuandSnCuNisolderareknownaslowriskoftinwhisker.Noconsiderablewhiskerlengthwasfound

byourin-housetest.

Wehighlyrecommendthatyouconfirmyouractualsolderconditions

Flow Solder condition:

Pre-heating:

maximum120˚C

Soldering:

dipwithin5sec.at

260˚Csolderbath

Solder by Soldering Iron:

SolderingIron

Temperature: maximum360˚C

Duration:

maximum3sec.

1. General Information

l

Ifapplicable,relaysproducedafterthespecificdatecodethatisindicatedoneachdatasheetarelead-free

now.Allofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

l

LeadfreesolderplatingcurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.FromFebruary2005forward

Sn-3.0Cu-NiwillbeusedfortheFTR-B3andFTR-B4seriesrelays.

l

AllsignalandpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata

sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat

arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE,decaBDEandPFOS).

l

Ithasbeenverifiedthatusinglead-freerelaysinleadedassemblyprocesswillnotcauseany

problems(compatible).

l

“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).

l

Toavoidleadcontainingrelays(forlead-freesample,etc.)pleaseconsultwithareasalesoffice.

l

Wewillshipleadcontainingrelaysaslongastheleadcontainingrelayinventoryexists.

Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)

2. Recommended Lead Free Solder Profile

l

RecommendedsolderpasteSn-3.0Ag-0.5CuorSn-3.0Cu-Ni(onlyFTR-B3andFTR-B4from

February2005.

max. 120 sec.

90~120 sec.

20~30 sec.

(duration)

Cooling

Pre-heating

Soldering

Peak Temp.: max. 250 C

250

220

130

130

170