1

FEATURES

A1

B1

A2

B2

GND

IO1

IO2

GND

APPLICATIONS

IO1

1

IO2

2

3

GND

DESCRIPTION/ORDERING INFORMATION

TPD2E007

2-CHANNEL ESD-PROTECTION ARRAY

FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES

YFMG4 PACKAGE

2

• ESD Protection Exceeds IEC61000-4-2

(BOTTOM VIEW)

(Level 4)

–

±15-kV Human-Body Model (HBM)

–

±8-kV IEC 61000-4-2 Contact Discharge

–

±15-kV IEC 61000-4-2 Air-Gap Discharge

• 4.5-A Peak Pulse Current (8/20 ms Pulse)

0.8 mm × 0.8 mm (0.4 mm pitch)

• 15-pF Line to GND Capacitance

• Low 50-nA Leakage Current

YFMG4 PIN DESCRIPTIONS

• 2-Channel Device

TERMINAL

• Space-Saving PicoStar™ and DCK Package

DESCRIPTION

NAME

NO.

IO

A1, A2 ESD-protection channel

GND

B1, B2 Ground

• Cell Phones, PDAs

• Audio Interface Connections

• Consumer Electronics (DVR, Set-Top Box, TV)

• Industrial Interface (RS-232, RS-485, RS-422,

LVDS)

DCK PACKAGE

(TOP VIEW)

This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for

wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or

negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal

integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board

space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to

provide system level ESD protection for the valuable internal ICs while placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages. The PicoStar™ package (YFMG4),

with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package

height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in

surface mount applications. The industry standard DCK package offers straightforward board layout option in

legacy designs.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

PicoStar is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008–2009, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.