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TPD2E007YFMRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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TPD2E007YFMRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 9 page 1 FEATURES A1 B1 A2 B2 GND IO1 IO2 GND APPLICATIONS IO1 1 IO2 2 3 GND DESCRIPTION/ORDERING INFORMATION TPD2E007 www.ti.com ........................................................................................................................................ SLVS796D – SEPTEMBER 2008 – REVISED OCTOBER 2009 2-CHANNEL ESD-PROTECTION ARRAY FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES YFMG4 PACKAGE 2 • ESD Protection Exceeds IEC61000-4-2 (BOTTOM VIEW) (Level 4) – ±15-kV Human-Body Model (HBM) – ±8-kV IEC 61000-4-2 Contact Discharge – ±15-kV IEC 61000-4-2 Air-Gap Discharge • 4.5-A Peak Pulse Current (8/20 ms Pulse) 0.8 mm × 0.8 mm (0.4 mm pitch) • 15-pF Line to GND Capacitance • Low 50-nA Leakage Current YFMG4 PIN DESCRIPTIONS • 2-Channel Device TERMINAL • Space-Saving PicoStar™ and DCK Package DESCRIPTION NAME NO. IO A1, A2 ESD-protection channel GND B1, B2 Ground • Cell Phones, PDAs • Audio Interface Connections • Consumer Electronics (DVR, Set-Top Box, TV) • Industrial Interface (RS-232, RS-485, RS-422, LVDS) DCK PACKAGE (TOP VIEW) This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to provide system level ESD protection for the valuable internal ICs while placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages. The PicoStar™ package (YFMG4), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard DCK package offers straightforward board layout option in legacy designs. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 PicoStar is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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