Transient Voltage Suppression Diodes

Revision: November 13, 2009

©2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Surface Mount – 1500W > SMCJ series

SMCJ Series

Please refer to http://www.Littelfuse.com/series/SMCJ.html for current information.

Physical Specifications

Weight

Case

Polarity

Color band denotes positive end

Terminal

Dimensions

Environmental Specifications

Temperature Cycle

Pressure Cooker

High Temp. Storage

HTRB

Thermal Shock

Soldering Parameters

Time (t)

T

s(min)

T

s(max)

T

L

T

P

t

s

Preheat

t

L

t

p

Ramp-up

Critical Zone

T

L

to T

P

Ramp-down

t 25˚C to Peak

25˚C

Reflow Condition

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

Average ramp up rate (LiquidusTemp

(T

T

Reflow

-Temperature (T

217°C

-Time (min to max) (t

PeakTemperature (T

260

°C

Time within 5°C of actual peak

Temperature (t

Ramp-down Rate

Time 25°C to peakTemperature (T

Do not exceed

Dimensions

Inches

Millimeters

Min

Max

Min

Max

A

0.114

0.126

0.260

6.600

7.110

C

0.220

0.245

6.220

2.060

2.620

0.060

0.760

1.520

7.750

0.006

0.012

0.152

I

2.400

0.165

4.200

2.400

DO-214AB (SMC J-Bend)

Cathode Band

B

F

G

H

E

C

D

A

I

L

K

J