PCA9545A_45B_45C_7

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 — 19 June 2009

5 of 28

NXP Semiconductors

PCA9545A/45B/45C

5.2 Pin description

[1]

and board-level performance, the exposed pad needs to be soldered to the board using a corresponding

thermal pad on the board, and for proper heat conduction through the board thermal vias need to be

incorporated in the PCB in the thermal pad region.

Table 3.

Pin description

Symbol

Pin

Description

SO20, TSSOP20

HVQFN20

A0

1

19

address input 0

A1

2

20

address input 1

RESET

3

1

active LOW reset input

INT0

4

2

active LOW interrupt input 0

SD0

5

3

serial data 0

SC0

6

4

serial clock 0

INT1

7

5

active LOW interrupt input 1

SD1

8

6

serial data 1

SC1

9

7

serial clock 1

10

8[1]

supply ground

INT2

11

9

active LOW interrupt input 2

SD2

12

10

serial data 2

SC2

13

11

serial clock 2

INT3

14

12

active LOW interrupt input 3

SD3

15

13

serial data 3

SC3

16

14

serial clock 3

INT

17

15

active LOW interrupt output

SCL

18

16

serial clock line

SDA

19

17

serial data line

20

18

supply voltage