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TSM600-250F-2 Datasheet(PDF) 17 Page - Tyco Electronics |
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TSM600-250F-2 Datasheet(HTML) 17 Page - Tyco Electronics |
17 / 22 page 203 RoHS Compliant, ELV Compliant 10 Dimension Description EIA Mark IEC Mark Dimension (mm) Tolerance Carrier tape width WW 18 -0.5/+1.0 Hold down tape width W4 W0 5 Minimum Top distance between tape edges W6 W2 3 Maximum Sprocket hole position W5 W1 9 -0.5/+0.75 Sprocket hole diameter D0 D0 4 ±0.2 Abcissa to plane (straight lead) HH 18.5 ±3.0 Abcissa to plane (kinked lead)* H0 H0 16 -0.5/+0.6 Abcissa to top H1 H1 32.2 Maximum Overall width with lead protrusion —C1 43.2 Maximum Overall width without lead protrusion —C2 42.5 Maximum Lead protrusion L1 I1 1.0 Maximum Protrusion of cut-out LL 11 Maximum Protrusion beyond hold down tape I2 I2 Not specified — Sprocket hole pitch P0 P0 12.7 ±0.3 Device pitch (TRF250 & TRF600-150) —— 12.7 — Device pitch (TRF600-160/400) —— 25.4 — Pitch tolerance —— 20 consecutive ±1 Tape thickness tt 0.9 Maximum Tape thickness with splice* t1 — 2.0 Maximum Splice sprocket hole alignment —— 0 ±0.3 Body lateral deviation h h0 ±1.0 Body tape plane deviation p p0 ±1.3 Lead spacing plane deviation P1 P1 0 ±0.7 Lead spacing* FF 5.08 ±0.6 Reel width w2 w 56 Maximum Reel diameter ad 370 Maximum Space between flanges less device w1 — 4.75 ±3.25 Arbor hole diameter cf 26 ±12.0 Core diameter nh 80 Maximum Box —— 56/372/372 Maximum Consecutive missing pieces* —— 3 maximum — Empty places per reel* —— Not specified — * Differs from EIA specification. TRF250/TRF600 devices are available in tape and reel packaging per EIA 468-B standard. See Figures T23 and T24 for details. Table T8 TRF250/TRF600 Tape and Reel Specifications for Telecommunications and Networking Device Wave Soldering and Rework Recommendations for Telecommunications Radial-leaded Devices Recommended Wave Soldering • Soldering temperature profile Temperature characteristic at component terminal with dual wave soldering Rework • If a device is removed from the board, it should be discarded and replaced with a new device. 300 250 200 150 100 50 0 0 50 10s 245˚C ... 260˚C 100˚C ... 130˚C Forced cooling 100150200 250 Time (s) Figure T22 |
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