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ZVP4525Z Datasheet(PDF) 2 Page - Zetex Semiconductors |
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ZVP4525Z Datasheet(HTML) 2 Page - Zetex Semiconductors |
2 / 8 page ISSUE 1 - MARCH 2001 ZVP4525Z 2 THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) RθJA 103 °C/W Junction to Ambient (b) RθJA 50 °C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t 5 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. NB High Voltage Applications For high voltage applications, the appropriate industry sector guidelines should be considered with regard to voltage spacing between conductors. ABSOLUTE MAXIMUM RATINGS. PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DSS 250 V Gate Source Voltage V GS ±40 V Continuous Drain Current (V GS=10V; TA=25°C)(a) (V GS=10V; TA=70°C)(a) I D I D -205 -164 mA mA Pulsed Drain Current (c) I DM -1 A Continuous Source Current (Body Diode) I S -0.75 A Pulsed Source Current (Body Diode) I SM -1 A Power Dissipation at T A=25°C (a) Linear Derating Factor P D 1.2 9.6 W mW/°C Operating and Storage Temperature Range T j:Tstg -55 to +150 °C |
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