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LM3S8630-EGZ25-A2T Datasheet(PDF) 9 Page - Texas Instruments |
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LM3S8630-EGZ25-A2T Datasheet(HTML) 9 Page - Texas Instruments |
9 / 546 page Figure 14-6. Data Validity During Bit Transfer on the I2C Bus ................................................... 350 Figure 14-7. Master Single SEND .......................................................................................... 353 Figure 14-8. Master Single RECEIVE ..................................................................................... 354 Figure 14-9. Master Burst SEND ........................................................................................... 355 Figure 14-10. Master Burst RECEIVE ...................................................................................... 356 Figure 14-11. Master Burst RECEIVE after Burst SEND ............................................................ 357 Figure 14-12. Master Burst SEND after Burst RECEIVE ............................................................ 358 Figure 14-13. Slave Command Sequence ................................................................................ 359 Figure 15-1. CAN Controller Block Diagram ............................................................................ 384 Figure 15-2. CAN Data/Remote Frame .................................................................................. 385 Figure 15-3. Message Objects in a FIFO Buffer ...................................................................... 393 Figure 15-4. CAN Bit Time .................................................................................................... 397 Figure 16-1. Ethernet Controller ............................................................................................. 431 Figure 16-2. Ethernet Controller Block Diagram ...................................................................... 431 Figure 16-3. Ethernet Frame ................................................................................................. 432 Figure 16-4. Interface to an Ethernet Jack .............................................................................. 437 Figure 17-1. 100-Pin LQFP Package Pin Diagram .................................................................. 477 Figure 17-2. 108-Ball BGA Package Pin Diagram (Top View) ................................................... 478 Figure 20-1. Load Conditions ................................................................................................ 507 Figure 20-2. JTAG Test Clock Input Timing ............................................................................. 509 Figure 20-3. JTAG Test Access Port (TAP) Timing .................................................................. 509 Figure 20-4. JTAG TRST Timing ............................................................................................ 510 Figure 20-5. External Reset Timing (RST) .............................................................................. 510 Figure 20-6. Power-On Reset Timing ..................................................................................... 511 Figure 20-7. Brown-Out Reset Timing .................................................................................... 511 Figure 20-8. Software Reset Timing ....................................................................................... 511 Figure 20-9. Watchdog Reset Timing ..................................................................................... 511 Figure 20-10. Hibernation Module Timing ................................................................................. 512 Figure 20-11. SSI Timing for TI Frame Format (FRF=01), Single Transfer Timing Measurement .................................................................................................... 513 Figure 20-12. SSI Timing for MICROWIRE Frame Format (FRF=10), Single Transfer ................. 514 Figure 20-13. SSI Timing for SPI Frame Format (FRF=00), with SPH=1 ..................................... 514 Figure 20-14. I2C Timing ......................................................................................................... 515 Figure 20-15. External XTLP Oscillator Characteristics ............................................................. 518 Figure D-1. 100-Pin LQFP Package ...................................................................................... 542 Figure D-2. 108-Ball BGA Package ...................................................................................... 544 9 April 04, 2010 Texas Instruments-Production Data Stellaris® LM3S8630 Microcontroller |
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