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ICS726A Datasheet(PDF) 3 Page - Integrated Device Technology

Part # ICS726A
Description  12 TO 36 MHZ 6TSOT VCXO
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

ICS726A Datasheet(HTML) 3 Page - Integrated Device Technology

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ICS726A
12 TO 36 MHZ 6TSOT VCXO
VCXO
IDT™ / ICS™ 12 TO 36 MHZ 6TSOT VCXO
3
ICS726A
REV D 051310
External Component Selection
The ICS726A requires a minimum number of external
components for proper operation.
Decoupling Capacitor
A decoupling capacitor of 0.01µF must be connected
between VDD (pin 4) and GND (pin 2), as close to these
pins as possible. For optimum device performance, the
decoupling capacitor should be mounted on the component
side of the PCB. Avoid the use of vias in the decoupling
circuit.
Series Termination Resistor
When the PCB trace between the clock output (CLK, pin 3)
and the load is over 1 inch, series termination should be
used. To series terminate a 50
Ω trace (a commonly used
trace impedance) place a 33
Ω resistor in series with the
clock line, as close to the clock output pin as possible. The
nominal impedance of the clock output is 20
Ω.
Quartz Crystal
The ICS726A VCXO function consists of the external crystal
and the integrated VCXO oscillator circuit. To assure the
best system performance (frequency pull range) and
reliability, a crystal device with the recommended
parameters (shown below) must be used, and the layout
guidelines discussed in the following section shown must be
followed.
The frequency of oscillation of a quartz crystal is determined
by its “cut” and by the load capacitors connected to it. The
ICS726A incorporates on-chip variable load capacitors that
“pull” (change) the frequency of the crystal. The crystal
specified for use with the ICS726A is designed to have zero
frequency error when the total of on-chip + stray
capacitance is 14 pF.
Required Crystal Parameters:
Nominal Frequency
as required MHz
Initial Accuracy at 25
° C
-20 min/+20 max ppm
Temperature Stability
-30 min/+30 max ppm
Aging, 1st year
-5 min/+5 max ppm
Aging, 10 years
-20 min/+20 max ppm
Operating Temp. Range, °C
0 min/+25 typ/+70 max
or
Operating Temp. Range, °C
-40 min/+25 typ/+85 max
Load Capacitance
10 pf
Shunt Capacitance, C0
7 pF Max
C0/C1 Ratio
270 Max
Equivalent Series Resistance
35
Ω Max
The third overtone mode of the crystal and all spurs must be
>100 ppm distant from the 3x fundamental resonance
measured with a physical load of 10 pF.
The external crystal must be connected as close to the chip
as possible and should be on the same side of the PCB as
the ICS726A. There should be no vias between the crystal
pins and the X1 and X2 device pins. There should be no
signal traces underneath or close to the crystal. See
application note MAN05.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture and
frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
The procedure for determining the value of these capacitors
can be found in application note MAN05.


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