Technical Note

2/15

BD8918F,BD8918FV,BD8919F,BD8919FV

www.rohm.com

2010.4 - Rev.D

© 2009 ROHM Co., Ltd. All rights reserved.

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Absolute maximum ratings (Ta=25°C)

Parameter

Symbol

Ratings

Unit

Notes

VDD Input Voltage

-0.3 ~ 6.5

V

VDDP Input Voltage

-0.3 ~ 6.5

V

I/O Pin Voltage

-0.3 ~ +6.5

V

Pin: XTAL1, XTAL2, CLKSEL, RSTIN, IO_U

CMDVCCB, OFFB

Card Contact Pin Voltage

-0.3 ~ +6.5

V

Pin: PRES, CLK, RST, IO_C

Junction Temperature

+150

°C

Storage Temperature

-55 ~ +150

°C

Power Dissipation

0.375

*1

0.500

*2

W

T = -20 ~ +85°C

(Refer to the following package power dissipation)

*1 BD8918F/BD8919F, *2 BD8918FV/BD8919FV

• This product is not designed to be radiation tolerant.

• Absolute maximum ratings are not meant for guarantee of operation.

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Operating Conditions (Ta=25°C)

Parameter

Symb

ol

Ratings

Unit

Notes

MIN

TYP

MAX

VDD Input Voltage

V

DD

2.7

-

5.5

V

VDDP Input Voltage

V

DDP

4.75

-

5.5

V

VCC ≥ 4.55V

Operating Temperature

T

opr

-40

-

+85

°C

●

Package Power Dissipation

The power dissipation of a simple package in case of a boadless will be as follows.

Use of this device beyond the following the power dissipation may cause permanent damage.

BD8918F/BD8919F

Pd=375mW; however, reduce 3mW per 1°C when used at Ta ≥ 25°C.

BD8918FV/BD8919FV

Pd=500mW; however, reduce 4mW per 1°C when used at Ta ≥ 25°C.

Fig. 1.1 BD8918F/BD8919F Power Dissipation

Fig. 1.2 BD8918FV/BD8919FV Power Dissipation

Package power

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0

25

50

75

100

125

150

Temp (℃)

Package power

0.0

0.1

0.2

0.3

0.4

0

25

50

75

100

125

150

Temp (℃)