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SN74LVC1G07 Datasheet(PDF) 2 Page - Texas Instruments |
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SN74LVC1G07 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 18 page DESCRIPTION/ORDERING INFORMATION SN74LVC1G07 SCES296W – FEBRUARY 2000 – REVISED JUNE 2008 .................................................................................................................................................. www.ti.com This single buffer/driver is designed for 1.65-V to 5.5-V VCC operation. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION ORDERABLE TOP-SIDE TA PACKAGE(1)(2) PART NUMBER MARKING(3) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74LVC1G07YZPR _ _ _CV_ 0.23-mm Large Bump – YZP (Pb-free) NanoFree™ – WCSP (DSBGA) _ _ _ _ Reel of 3000 SN74LVC1G07YZVR 0.23-mm Large Bump – YZV (Pb-free) CV SN74LVC1G07DRYR SON – DRY Reel of 5000 CV_ –40 =C to SN74LVC1G07DRYRG4 85 =C Reel of 3000 SN74LVC1G07DBVR SOT (SOT-23) – DBV C07_ Reel of 250 SN74LVC1G07DBVT Reel of 3000 SN74LVC1G07DCKR SOT (SC-70) – DCK CV_ Reel of 250 SN74LVC1G07DCKT SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G07DRLR CV_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2 has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 2 Submit Documentation Feedback Copyright © 2000–2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC1G07 |
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