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AP7365-18ERG-7 Datasheet(PDF) 4 Page - Diodes Incorporated |
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AP7365-18ERG-7 Datasheet(HTML) 4 Page - Diodes Incorporated |
4 / 21 page AP7365 600mA, Low Quiescent Current, Fast Transient Low Dropout Linear Regulator AP7365 Document number: DS32260 Rev. 1 - 2 4 of 21 www.diodes.com July 2010 © Diodes Incorporated Electrical Characteristics (TA = 25 oC, V IN = VOUT +1V, CIN = 1μF, COUT = 1μF, VEN = 2V, unless otherwise stated) Symbol Parameter Test Conditions Min Typ. Max Unit VREF ADJ Reference Voltage (Adjustable version) IOUT= 0mA 0.8 V IADJ ADJ Leakage (Adjustable version) 0.1 1 μA VOUT Output Voltage Accuracy TA = -40 oC to 85oC, IOUT = 10% of IOUT-Max -2 2 % ΔV OUT / ΔV IN/V Line Regulation VIN = (VOUT +1V) to VIN-Max, VEN = VIN, IOUT = 1mA 0.02 0.20 %/V ΔV OUT /VOUT Load Regulation VIN = (VOUT +1V) to VIN-Max, IOUT = 1mA to 600mA -1.0 1.0 % VDropout Dropout Voltage (Note 3) VOUT < 2.5V, IOUT = 600mA 370 600 mV VOUT ≥ 2.5V, IOUT = 600mA 300 400 IQ Input Quiescent Current VEN = VIN, IOUT = 0mA 35 80 μA ISHDN Input Shutdown Current VEN = 0V, IOUT = 0mA 0.1 1 μA ILEAK Input Leakage Current VEN = 0V, OUT grounded 0.1 1 μA tST Start-up Time VEN = 0V to 2.0V in 1μs, IOUT = 600mA 200 μs PSRR PSRR (Note 4) VIN = [VOUT +1V]VDC + 0.5VppAC, f = 1kHz, IOUT = 50mA 65 dB ISHORT Short-circuit Current VIN = VIN-Min to VIN-Max, VOUT < 0.2V (fixed version) or 25% of VOUT (ADJ version) 240 mA ILIMIT Current limit VIN = VIN-Min to VIN-Max, VOUT/ROUT = 2.5A 0.8 1.4 A VIL EN Input Logic Low Voltage VIN = VIN-Min to VIN-Max 0.4 V VIH EN Input Logic High Voltage VIN = VIN-Min to VIN-Max 1.4 V IEN EN Input Current VIN = 0V or VIN-Max -1 1 μA TSHDN Thermal shutdown threshold 145 °C THYS Thermal shutdown hysteresis 15 °C θ JA Thermal Resistance Junction-to-Ambient SOT25 (Note 5) 187 oC/W DFN2020-6 (Note 5) 251 SOT89-3L (Note 5) 141 SOT223-3L (Note 5) 153 Notes: 3. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal value. 4. At VIN < 2.3V, the PSRR performance may be reduced. 5. Test condition for all packages: Device mounted on FR-4 substrate PC board, 1oz copper, with minimum recommended pad layout. |
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