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NCP1532MUAATXG Datasheet(PDF) 4 Page - ON Semiconductor

Part # NCP1532MUAATXG
Description  Dual Output Step-Down Converter 2.25 MHz High-Efficiency, Out of Phase Operation, Low Quiescent Current, Source up to 1.6 A
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP1532MUAATXG Datasheet(HTML) 4 Page - ON Semiconductor

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NCP1532
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4
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Minimum Voltage All Pins
Vmin
−0.3
V
Maximum Voltage All Pins (Note 1)
Vmax
7.0
V
Maximum Voltage EN1, EN2, MODE
Vmax
VIN + 0.3
V
Thermal Resistance Junction−to−Air (UDFN10 Package)
Thermal Resistance Using Recommended Board Layout (Note 8)
RqJA
200
40
°C/W
Operating Ambient Temperature Range (Notes 6 and 7)
TA
−40 to 85
°C
Storage Temperature Range
Tstg
−55 to 150
°C
Junction Operating Temperature (Notes 6 and 7)
TJ
−40 to 150
°C
Latchup Current Maximum Rating TA = 85°C (Note 4) Other Pins
Lu
$100
mA
ESD Withstand Voltage (Note 3)
Human Body Model
Machine Model
Vesd
2.0
200
kV
V
Moisture Sensitivity Level (Note 5)
MSL
1
per IPC
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C
2. According JEDEC standard JESD22−A108B
3. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) per JEDEC standard: JESD22−A114
Machine Model (MM) per JEDEC standard: JESD22−A115
4. Latchup current maximum rating per JEDEC standard: JESD78.
5. JEDEC Standard: J−STD−020A.
6. In applications with high power dissipation (low VIN, high IOUT), special care must be paid to thermal dissipation issues. Board design
considerations − thermal dissipation vias, traces or planes and PCB material − can significantly improve junction to air thermal resistance
RqJA (for more information, see design and layout consideration section). Environmental conditions such as ambient temperature Ta brings
thermal limitation on maximum power dissipation allowed.
The following formula gives calculation of maximum ambient temperature allowed by the application: TA(max) = TJ(max) − (RqJA x Pd)
Where
TJ is the junction temperature,
Pd is the maximum power dissipated by the device (worst case of the application), and RqJA is the junction−to−ambient thermal
resistance.
7. To prevent permanent thermal damages, this device include a thermal shutdown which engages at 180°C (typical).
8. Board recommended UDFN10 layout is described in Layout Considerations section.


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