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NCP2811AFCT1G Datasheet(PDF) 5 Page - ON Semiconductor

Part # NCP2811AFCT1G
Description  NOCAP Advanced Stereo Headphone Amplifier
Download  14 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP2811AFCT1G Datasheet(HTML) 5 Page - ON Semiconductor

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Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
AVIN, PVIN Pins: Power Supply Voltage (Note 2)
VP
− 0.3 to + 6.0
V
INL, INR Pins: Input (Note 2)
A version
B version
VIN
−VP – 0.3 to VP + 0.3
−2 to +2
V
SD Pin: Input (Note 2)
VYY
−0.3 to VP + 0.3
V
Human Body Model (HBM) ESD Rating are (Note 3)
ESD HBM
2000
V
Machine Model (MM) ESD Rating are (Note 3)
ESD MM
200
V
CSP 1.5 x 2.0 mm package (Notes 6 and 7)
Thermal Resistance Junction to Case
RqJC
(Note 7)
°C/W
Operating Ambient Temperature Range
TA
−40 to + 85
°C
Operating Junction Temperature Range
TJ
−40 to + 125
°C
Maximum Junction Temperature (Note 6)
TJMAX
+ 150
°C
Storage Temperature Range
TSTG
−65 to + 150
°C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Notes:
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with
50 mm2. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation.
RqCA +
125 * TA
PD
* RqJC


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