NCP2823 Series

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3

PIN FUNCTION DESCRIPTION

Pin

Pin

Name

Type

Description

A1

INP

INPUT

Positive Differential Input

C1

INN

INPUT

Negative Differential Input

B2

PVDD

POWER

Power Supply: This pin is the power supply of the device. A 4.7 mF ceramic capacitor or larger must

bypass this input to the ground. This capacitor should be placed as close a possible to this input.

B1

AVDD

POWER

Analog Power Supply: This pin must be connected to PVDD.

C3

VOUTP

OUTPUT

Positive output Special care must be observed at layout level. See the Layout recommendations.

A3

VOUTN

OUTPUT

Negative output: Special care must be observed at layout level. See the Layout recommendations.

C2

EN

INPUT

Enable: When a High logic is applied to this pin, the device is activated

B3

PGND

POWER

Power Ground: This pin is the power ground and carries the high switching current. A high quality

ground must be provided to avoid any noise spikes/uncontrolled operation. Care must be observed to

avoid high−density current flow in a limited PCB copper track.

A2

AGND

POWER

Analog Ground: This pin is the analog ground of the device and must be connected to GND plane.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

AVDD, PVDD Pins: Power Supply Voltage (Note 2)

−0.3 to +6.0

V

INP/N ,Pins: Input (Note 2)

V

Digital Input/Output: EN Pin:

Input Voltage

Input Current

1

V

mA

Human Body Model (HBM) ESD Rating are (Note 3)

ESD HBM

2000

V

Machine Model (MM) ESD Rating are (Note 3)

ESD MM

200

V

WCSP 1.5 x 1.5 mm package (Notes 6 and 7)

Thermal Resistance Junction−to−Case

90

°C/W

Operating Ambient Temperature Range

−40 to +85

°C

Operating Junction Temperature Range

−40 to +125

°C

Maximum Junction Temperature (Note 6)

+150

°C

Storage Temperature Range

−65 to +150

°C

Moisture Sensitivity (Note 5)

MSL

Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

2. According to JEDEC standard JESD22−A108B.

3. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.

Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.

4. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.

5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.

6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.

output current and external components selected.