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ADS5484IRGCTG4 Datasheet(PDF) 3 Page - Texas Instruments

Part # ADS5484IRGCTG4
Description  16-Bit, 170/200-MSPS Analog-to-Digital Converters
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ADS5484IRGCTG4 Datasheet(HTML) 3 Page - Texas Instruments

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ADS5484
ADS5485
www.ti.com ............................................................................................................................................... SLAS610C – AUGUST 2008 – REVISED OCTOBER 2009
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS5484, ADS5485
UNIT
AVDD5 to GND
6
V
Supply voltage
AVDD3 to GND
5
V
DVDD3 to GND
5
V
AC signal. Valid when AVDD5 is within normal operating range. When
AVDD5 is off, analog inputs should be < 0.5 V. If not, the protection
Analog input to GND
diode between the inputs and AVDD5 becomes forward-biased and
–0.3 to (AVDD5 + 0.3)
V
could be damaged or shorten device lifetime (see Figure 30). Short
transient conditions during power on/off are not a concern.
Analog INP to INM
DC signal
±4
V
Valid when AVDD3 is within normal operating range. When AVDD3 is
off, clock inputs should be < 0.5 V. If not, the protection diode between
Clock input to GND
the inputs and AVDD3 becomes forward-biased and could be
–0.3 to (AVDD3 + 0.3)
V
damaged or shorten device lifetime (see Figure 37). Short transient
conditions during power on/off are not a concern.
CLKP to CLKM
±2.5
V
Digital data output to GND
–0.3 to (DVDD3 + 0.3)
V
Digital data output plus-to-minus
±1
V
Operating temperature range
–40 to 85
°C
Maximum junction temperature
150
°C
Storage temperature range
–65 to 150
°C
ESD, human-body model (HBM)
2
kV
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon
request.
THERMAL CHARACTERISTICS
(1)
PARAMETER
TEST CONDITIONS
TYP
UNIT
Soldered thermal pad, no airflow
20
RθJA
Soldered thermal pad, 150-LFM airflow
16
°C/W
RθJC
Thermal resistance from the junction to the package case (top)
7
RθJP
Thermal resistance from the junction to the thermal pad (bottom)
0.2
(1)
Using 49 thermal vias ( 7 × 7 array). See PowerPAD Package in the Application Information section.
Copyright © 2008–2009, Texas Instruments Incorporated
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Product Folder Link(s): ADS5484 ADS5485


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