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SN74AUP1G99 Datasheet(PDF) 2 Page - Texas Instruments |
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SN74AUP1G99 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 24 page www.ti.com DESCRIPTION/ORDERING INFORMATION SN74AUP1G99 LOW-POWER ULTRA-CONFIGURABLE MULTIPLE-FUNCTION GATE WITH 3-STATE OUTPUTS SCES594C – JULY 2004 – REVISED DECEMBER 2007 The SN74AUP1G99 features configurable multiple functions with a 3-state output. This device has the input-disable feature, which allows floating input signals. The inputs and output are disabled when the output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input. The user can choose the logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND. This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Tape and reel SN74AUP1G99YZPR _ _ HY_ (Pb-free) –40 °C to 85°C SSOP – DCT Tape and reel SN74AUP1G99DCTR H99_ _ _ VSSOP – DCU Tape and reel SN74AUP1G99DCUR H99_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 2 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G99 |
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