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ADS5400IPZP Datasheet(PDF) 2 Page - Texas Instruments |
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ADS5400IPZP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 50 page ADS5400 SLAS611B – OCT 2009 – REVISED MARCH 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Table 1. PACKAGE/ORDERING INFORMATION SPECIFIED PACKAGE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD TEMPERATURE DESIGNATOR (1) MARKING NUMBER MEDIA, QUANTITY RANGE ADS5400IPZP Tray, 90 HTQFP-100 ADS5400 PZP –40°C to 85°C ADS5400I PowerPAD ADS5400IPZPR Tape and reel, 1000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT AVDD5 to GND 6 V Supply voltage AVDD3 to GND 5 V DVDD3 to GND 5 V AINP, AINN to GND(2) voltage difference between pin and ground 0.5 to 4.5 V short duration –0.3 to (AVDD5 + 0.3) V voltage difference between AINP to AINN (2) pins, common mode at continuous AC signal 1.25 to 3.75 V AVDD5/2 continuous DC signal 1.75 to 3.25 V CLKINP, CLKINN to GND (2) voltage difference between pin and ground 0.5 to 4.5 V voltage difference between continuous AC signal 1.1 to 3.9 V CLKINP to CLKINN (2) pins, common mode at continuous DC signal 2 to 3 V AVDD5/2 RESETP, RESETN to GND (2) voltage difference between pin and ground –0.3 to (AVDD5 + 0.3) V continuous AC signal 1.1 to 3.9 V voltage difference between RESETP to RESETN (2) pins continuous DC signal 2 to 3 V Data/OVR Outputs to GND (2) –0.3 to (DVDD3 + 0.3) SDENB, SDIO, SCLK to GND(2) –0.3 to (AVDD3 + 0.3) voltage difference between pin and ground V ENA1BUS, ENPWD, ENEXTREF –0.3 to (AVDD5 + 0.3) to GND(2) Operating temperature range –40 to 85 °C Maximum junction temperature, TJ 150 °C Storage temperature range –65 to 150 °C ESD, human-body model (HBM) 2 kV (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon request. (2) Valid when supplies are within recommended operating range. THERMAL CHARACTERISTICS (1) PARAMETER TEST CONDITIONS TYP UNIT Soldered thermal pad, no airflow 28.4 RqJA (2) Soldered thermal pad, 150-LFM airflow 16.6 °C/W Soldered thermal pad, 250-LFM airflow 13.5 RqJP (3) Bottom of package (thermal pad) 0.16 °C/W (1) Using 25 thermal pad vias (5 × 5 array). See PowerPAD Package in the Application Information section. (2) RqJA is the thermal resistance from the junction to ambient. (3) RqJP is the thermal resistance from the junction to the thermal pad. 2 Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS5400 |
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