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SN74AUP1G74 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74AUP1G74 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 24 page DCT PACKAGE (TOP VIEW) 3 2 4 5 1 CLK V CC PRE D GND Q CLR Q 6 7 8 DCU PACKAGE (TOP VIEW) 1 8 2 7 3 6 4 5 CLK D GND Q V Q CC PRE CLR PRE RSE PACKAGE (TOP VIEW) 1 7 2 6 8 3 5 4 V CC CLR Q GND CLK D Q 1 8 2 7 3 6 4 5 V CC DQE PACKAGE (TOP VIEW) CLK GND D Q PRE CLR Q YFP OR YZP PACKAGE (TOP VIEW) GND CLK Q Q V CC CLR PRE 1 8 2 7 3 6 4 5 D1 D2 C1 C2 B1 B2 A1 A2 SN74AUP1G74 www.ti.com SCES644C – MARCH 2006 – REVISED MARCH 2010 LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Check for Samples: SN74AUP1G74 1 FEATURES • Available in the Texas Instruments NanoStar™ • Wide Operating VCC Range of 0.8 V to 3.6 V Package • Optimized for 3.3-V Operation • Low Static-Power Consumption: • 3.6-V I/O Tolerant to Support Mixed-Mode ICC = 0.9 mA Max Signal Operation • Low Dynamic-Power Consumption: • tpd = 5 ns Max at 3.3 V Cpd = 5.5 pF Typ at 3.3 V • Suitable for Point-to-Point Applications • Low Input Capacitance: Ci = 1.5 pF Typ • Latch-Up Performance Exceeds 100 mA Per • Low Noise – Overshoot and Undershoot JESD 78, Class II <10% of VCC • ESD Performance Tested Per JESD 22 • Ioff Supports Partial-Power-Down Mode – 2000-V Human-Body Model Operation (A114-B, Class II) • Schmitt-Trigger Action Allows Slow Input – 1000-V Charged-Device Model (C101) Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typ at 3.3 V) See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2006–2010, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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