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SN74LVC1G97DBVRE4 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G97DBVRE4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 18 page www.ti.com FEATURES 3 2 4 6 1 In1 In2 Y GND In0 DBV PACKAGE (TOP VIEW) YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 6 1 In1 In2 Y GND In0 3 2 4 6 1 In1 In2 Y GND In0 In1 In0 In2 Y GND DRL PACKAGE (TOP VIEW) See mechanical drawings for dimensions. 1 4 2 3 6 VCC VCC VCC 5 VCC 5 5 5 DESCRIPTION/ORDERING INFORMATION SN74LVC1G97 CONFIGURABLE MULTIPLE-FUNCTION GATE SCES416J – DECEMBER 2002 – REVISED JANUARY 2007 • Available in the Texas Instruments • Latch-Up Performance Exceeds 100 mA Per NanoFree™ Package JESD 78, Class II • Supports 5-V V CC Operation • ESD Protection Exceeds JESD 22 • Inputs Accept Voltages to 5.5 V – 2000-V Human-Body Model (A114-A) • Max t pd of 6.3 ns at 3.3 V – 200-V Machine Model (A115-A) • Low Power Consumption, 10-µA Max I CC – 1000-V Charged-Device Model (C101) • ±24-mA Output Drive at 3.3 V • Choose From Nine Specific Logic Functions • I off Supports Partial-Power-Down Mode Operation This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VCC or GND. This device functions as an independent gate, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74LVC1G97YZPR _ _ _CS_ 0.23-mm Large Bump – YZP (Pb-free) SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G97DBVR C97_ –40°C to 85°C SOT (SC-70) – DCK Reel of 3000 SN74LVC1G97DCKR CS_ SOT (SOT-563) – DRL Reel of 4000 SN74LVC1G97DRLR CS_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2002–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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