 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
TM8L106M016UBA Datasheet(PDF) 9 Page - Vishay Siliconix |
|
||||||||||||||||||||||||||||||
TM8L106M016UBA Datasheet(HTML) 9 Page - Vishay Siliconix |
|
|
9 / 10 page  TM8 Vishay Sprague Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded www.vishay.com For technical questions, contact: tantalum@vishay.com Document Number: 40133 46 Revision: 22-Jun-10 GUIDE TO APPLICATION 1. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: where, P = Power dissipation in watts at + 25 °C as given in the table in paragraph number 5 (power dissipation). RESR = The capacitor equivalent series resistance at the specified frequency. 2. A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: or, from the formula: where, P = Power dissipation in watts at + 25 °C as given in the table in paragraph number 5 (power dissipation). RESR = The capacitor equivalent series resistance at the specified frequency. Z = The capacitor impedance at the specified frequency. 2.1 The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. 2.2 The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at + 25 °C. 3. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at + 25 °C, 5 % of the DC rating at + 85 °C and 1 % of the DC rating at + 125 °C. 4. Temperature Derating: If these capacitors are to be operated at temperatures above + 25 °C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: 5. Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using + 25 °C temperature rise.) 6. Printed Circuit Board Materials: Molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment: 7.1 Solder Paste: The recommended thickness of the solder paste after application is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: Capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time/temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per second. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. 7.2.1 Backward and Forward Compatibility: Capacitors with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: Molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 minutes. 9. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. TEMPERATURE DERATING FACTOR + 25 °C 1.0 + 85 °C 0.9 + 125 °C 0.4 I rms P R ESR ---------------- = V rms Z P R ESR ---------------- = V rms I rms Z × = |
Similar Part No. - TM8L106M016UBA |
|
Similar Description - TM8L106M016UBA |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.NET |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
