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74ALVCH32501 Datasheet(PDF) 2 Page - NXP Semiconductors |
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74ALVCH32501 Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 15 page 2004 Oct 13 2 Philips Semiconductors Product specification 36-bit universal bus transceiver with direction pin; 3-state 74ALVCH32501 FEATURES • 3-state non-inverting outputs for bus oriented applications • Wide supply voltage range of 1.2 V to 3.6 V • Complies with JEDEC standard no. 8-1A • Current drive ±24 mA at 3.0 V • Universal bus transceiver with D-type latches and D-type flip-flops capable of operating in transparent, latched or clocked mode • CMOS low power consumption • Direct interface with TTL levels • All inputs have bus-hold circuitry • Output drive capability 50 Ω transmission lines at 85 °C • Plastic fine-pitch ball grid array package. DESCRIPTION The 74ALVCH32501 is a high-performance CMOS product designed for VCC operation at 2.5 V and 3.3 V. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The 74ALVCH32501 can be used as two 18-bit transceivers or one 36-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. Data flow in each direction is controlled by output enable (OEAB and OEBA), latch enable (LEAB and LEBA), and clock inputs (CPAB and CPBA). For A-to-B data flow, the device operates in the transparent mode when LEAB is HIGH. When input LEAB is LOW, the A data is latched if input CPAB is held at a HIGH or LOW level. If input LEAB is LOW, the A data is stored in the latch/flip-flop on the LOW-to-HIGH transition of CPAB. When input OEAB is HIGH, the outputs are active. When input OEAB is LOW, the outputs are in the high-impedance state. Data flow for B-to-A is similar to that of A-to-B, but uses inputs OEBA, LEBA and CPBA. The output enables are complimentary (OEAB is active HIGH, and OEBA is active LOW). To ensure the high-impedance state during power-up or power-down, pin OEBA should be tied to VCC through a pull-up resistor and pin OEAB should be tied to GND through a pull-down resistor. The minimum value of the resistor is determined by the current-sinking or current-sourcing capability of the driver. QUICK REFERENCE DATA GND = 0 V; Tamb =25 °C; tr =tf ≤ 2.5 ns. Note 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. SYMBOL PARAMETER CONDITIONS TYP. UNIT tPHL/tPLH propagation delay An to Bn;Bn to An CL = 30 pF; VCC = 2.5 V 2.8 ns CL = 50 pF; VCC = 3.3 V 3.0 ns CI input capacitance 4.0 pF CI/O input/output capacitance 8.0 pF CPD power dissipation capacitance per latch VI = GND to VCC; note 1 outputs enabled 21 pF outputs disabled 3 pF |
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