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KM48S8030 Datasheet(PDF) 6 Page - Samsung semiconductor

Part # KM48S8030
Description  2M x 8Bit x 4 Banks Synchronous DRAM
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KM48S8030 Datasheet(HTML) 6 Page - Samsung semiconductor

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KM48S8030C
PC133 CMOS SDRAM
REV. 0 Oct. '98
Preliminary
AC OPERATING TEST CONDITIONS (VDD = 3.3V
± 0.3V, TA = 0 to 70°C)
Parameter
Value
Unit
Input levels (Vih/Vil)
2.4/0.4
V
Input timing measurement reference level
1.4
V
Input rise and fall time
tr/tf = 1/1
ns
Output timing measurement reference level
1.4
V
Output load condition
See Fig. 2
3.3V
1200
870
Output
50pF
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
Vtt = 1.4V
50
Output
50pF
Z0 = 50
(Fig. 2) AC output load circuit
(Fig. 1) DC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Symbol
Version
Unit
Note
-A
Row active to row active delay
tRRD(min)
2
CLK
1
RAS to CAS delay
tRCD(min)
3
CLK
1
Row precharge time
tRP(min)
3
CLK
1
Row active time
tRAS(min)
6
CLK
1
tRAS(max)
100
us
Row cycle time
tRC(min)
9
CLK
1
Last data in to row precharge
tRDL(min)
2
CLK
2
Last data in to new col. address Delay
tCDL(min)
1
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
Col. address to col. address delay
tCCD(min)
1
CLK
3
Number of valid output data
CAS latency=3
2
ea
4
-
-
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
Notes :


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